Ogłoszenie numer: 1232173, from 2016-08-19
kandou Bus
www.kandou.com
Kandou to Expand Research & Development
Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed Chord signaling for enhanced communications between chips inside electronic systems ranging from cell phones to servers and high performance computing.
“We see Chord signaling as a game changer in semiconductors,” said Bessemer venture capitalist Felda Hardymon. “The demand for higher performance and lower power consumption in computing systems necessitates fundamental changes in semiconductor interconnect solutions. Kandou’s technology comes at a time when existing chip link technologies are failing. We are confident that Kandou can further develop and deploy Chord signaling in several future generations of chips.”
Kandou CEO and Founder Amin Shokrollahi’s extensive background in information theory and coding-based signaling led to the invention of Chord signaling. The technology delivers 2-4x more bandwidth and half the power consumption of traditional differential signaling. It achieves this by sending multiple bits over multiple correlated wires within each clock cycle versus differential signaling’s one bit over two correlated wires. In addition to improved performance, the result is better board, pin and silicon area efficiency as compared to existing chip interface solutions. This approach also delivers excellent signal integrity, strong resistance to common-mode and simultaneous switching noise, and a reduction of inter-symbol interference.
This financing announcement comes after several other key milestones in 2016 including: presenting a paper at DesignCon that was recognized as a Best Paper, announcing Marvell Technology Group as a licensee of Kandou’s Glasswing™ chip-to-chip link technology, and Kandou’s Glasswing IP compliance with the newly-released JEDEC specification for multi-wire interfaces called JESD247.
Engineer
Location: Wielka Brytania, Northampton
Job description
position in design, layout and verification of analog integrated circuits for high speed chip to chip communication links (SerDes and/or memory IO) in advanced technology nodes (28nm and below).
Key Responsibilities
- Develop block level specifications of very high-speed analog circuits that meet key performance targets based on system level requirements.
- Design, layout and verification of analog circuits.
- Support IP and chip level integration. Guide layout team, mentor junior team members.
- Support lab characterization, debug/test and productization.
- Support and interact with customers on requirements, design specifications, performance results and product delivery.
Requirements
- Willingness to relocate to the UK
- Experience in analog design of key circuits in multi-gigabit serial data-link transceivers like output drivers, equalizers, clock generators, clock and data recovery circuits, samplers, etc. Expertise in design and layout of high-speed circuits like amplifiers, oscillators, phase-locked loops, delay-locked loops, and other fundamental building blocks like biasing, buffers, regulators, filters, data converters, etc. Ideally with experience on modern process technologies down to 14/16nm.
- User of EDA tool for design and verification like Cadence Virtuoso, Spectre/HSpice, Calibre/PVS DRC/LVS, parasitics extraction and modeling, EM and IR drop, etc. Experience in high-level modeling, top-level simulations, ESD checks will be a plus. Self motivated, with strong sense of ownership and responsibility. Good communicator and team player.
- Bachelor or higher in E.E. (for non-layout position), Communications or other relevant fields.